EPIKOTE BP 20 Structural Bonding Paste
EPIKOTE™ MGS® BP 20 Structural Bonding Paste
EPIKOTE™ MGS® BP 20 is a fast-setting, two-component epoxy bonding paste designed for clean, accurate, and reliable adhesive applications in composite manufacturing and repair. Supplied in convenient cartridge form, it enables precise dispensing for both production environments and on-site repairs.
Formulated for strong adhesion across composite substrates and metals, BP 20 is particularly suited to composite-to-composite and composite-to-metal bonding, delivering dependable performance with minimal waste and easy application.
Key Features
- Cartridge system for clean, controlled application
- Fast-setting for efficient bonding and repairs
- Excellent adhesion to composites and metals
- Ideal for small to medium bonding applications
- Strong mechanical performance after post cure
- Long shelf life (up to 24 months sealed)
Performance & Processing
- Processing temperature: above 10°C
- Operational temperature: -50°C to +70°C
- Post cure: ~3 hours at 50–60°C for full performance
- DMA onset temperature: ~80°C
The DMA graph on page 2 shows thermal performance reaching peak stability around ~95°C after heat treatment, confirming suitability for structural bonding in elevated temperature environments.
Mechanical Performance
- Tensile strength: ~58.7 MPa
- Tensile shear strength: ~16.5 MPa
- Compressive strength: ~94.9 MPa
Typical Applications
- Composite repairs (GFRP, CFRP)
- Composite-to-metal bonding
- Structural bonding in production
- Maintenance and field repairs
Why Use BP 20
BP 20 is the go-to solution when you need fast, clean, and reliable bonding without the hassle of mixing by hand. Its cartridge system and strong adhesion make it ideal for workshop use and on-site repairs where speed and consistency matter.
