EPIKOTE BPR135G3 Structural Bonding Paste

EPIKOTE™ MGS® BPR135G3 Structural Bonding Paste

EPIKOTE™ MGS® BPR135G3 is a high-performance, solvent-free epoxy bonding paste designed for structural bonding in demanding composite applications. Engineered for reliability and ease of use, it delivers strong adhesion across FRP laminates, wood, and a range of metallic and mineral substrates.

With excellent gap-filling capability and non-sag properties, this system is ideal for large bond lines and vertical applications, making it widely used in industries such as wind energy, marine, and tooling.


Key Features

  • High-strength structural bonding performance
  • Excellent gap filling (up to ~30 mm) without sagging
  • Suitable for vertical and overhead applications
  • Wide range of curing speeds via hardener selection
  • Good performance at elevated temperatures
  • Long shelf life (24 months sealed)

Performance & Processing

  • Processing temperature: 10°C – 50°C
  • Optimal application temperature: 20°C – 30°C
  • Operational temperature: -40°C to +70°C after cure
  • Pot life range: approx. 30 to 165 minutes depending on hardener

Mechanical Performance

  • Lap shear strength: up to ~24 MPa (thin bond line)
  • Tensile strength: ~70 MPa
  • Peel strength: > 2 N/mm

Typical Applications

  • FRP-to-FRP structural bonding
  • Composite bonding in wind turbine blades
  • Marine and shipbuilding applications
  • Tooling and mould assembly
  • Bonding of wood, metals, and composite structures

Why Use BPR135G3

BPR135G3 is built for serious structural bonding where standard adhesives won’t cut it. Its ability to handle large gaps, vertical surfaces, and heavy-duty loads makes it the go-to solution for high-strength composite assembly.